| IEEE MICRO | Hsien-Hsin S. Lee. "Toward Disaggregated and Heterogenous AI Systems." In IEEE MICRO Special on Hot Chips, Volume 45, Issue 3, May/June, 2025. |
| IEEE MICRO | Hsien-Hsin S. Lee. "Taiwan Semiconductor Manufacturing Company's $165 Billion Bet." In IEEE MICRO Special on Hot Interconnects and COOL Chips, Volume 45, Issue 2, March/April, 2025.
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| IEEE MICRO | Hsien-Hsin S. Lee. "Rise of the Agentic AI Workforce." In IEEE MICRO Special on Interconnects for Chiplet Integration Technologies, Volume 45, Issue 1, Jan/Feb, 2025.
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| IEEE MICRO | Hsien-Hsin S. Lee. "Strategic Pivot of Long-Standing x86 Rivals." In IEEE MICRO Special on Contemporary Industry Products 2024, Volume 44, Issue 6, Nov/Dec, 2024.
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| IEEE MICRO | Hsien-Hsin S. Lee. "The Path to Powering Intelligence." In IEEE MICRO Special on The Past, Present, and Future of Warehouse-Scale Computing, Volume 44, Issue 5, Sept/Oct, 2024.
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| IEEE MICRO | Hsien-Hsin S. Lee. "Top Picks Ignite Innovation." In IEEE MICRO Special on Top Picks of Computer Architecture Conferences of 2023, Volume 44, Issue 4, July/August, 2024.
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| IEEE MICRO | Hsien-Hsin S. Lee. "An Incoming World of Decoupling Siliconomy." In IEEE MICRO Special on Hot Chips, Volume 44, Issue 3, May/June, 2024.
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| IEEE MICRO | Hsien-Hsin S. Lee. "Beyond Wires: The Future of Interconnects." In IEEE MICRO Special on Hot Interconnects, Volume 44, Issue 2, March/April, 2024.
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| IEEE MICRO | Hsien-Hsin S. Lee. "Computing with COOL Chips." In IEEE MICRO Special on COOL Chips, Volume 44, Issue 1, Jan/Feb, 2024.
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